ASM SIPLACE X S series SMT Assembly line

Placement Speed: 375,000 CPH
Accuracy：±25 μm @ 3 σ
Component Range: 0201 ~ □200*125*25mm（L*W*H）
PCB size(mm):Max. L850*W685

BASIC INFO

ASM SIPLACE X S series SMT Assembly line

ASM SIPLACE X S series SMT Assembly line configuration:

1.PCB Loader

2.SMT stencil Printer DEK NeoHorizon 03 iX

3.KOH YOUNG KY8030-3 3D SPI

4.NG buffer Conveyor

5.ASM SIPLACE X4iS*2 CP20 Head *8 Pick and place machine

6.ASM SIPLACE SX2 CPP+TH Head Pick and place machine

7.Heller 2043 MK7 SMT reflow oven

8.KOH YOUNG ZENITH 3D AOI

9.NG/OK Unloader

Placement Speed: 375,000 CPH

Accuracy：±22 μm @ 3 σ

Feeder Capacity(8mm): 440ea

Component Range: 0201 ~ □200*125*25mm（L*W*H）

PCB size(mm):Max. L850*W685

1. PCB loader

PCB frame loading machine is a kind of automatic loading equipment for electronic components PCB board. It is usually composed of a conveying system, a positioning system, and an upper plate manipulator.
The working principle is to place the PCB board and component material that need to be mounted on the board in the material frame, and send the material frame to the machine through the conveying system. Then, the positioning system is used to accurately locate the position of the PCB board, and then the components are removed from the material frame by the upper board manipulator and placed on the PCB board accurately.

2. SMT stencil Printer DEK NeoHorizon 03iX

DEK NeoHorizon Solder paste printer

Maximum flexibility for the integrated smart factory

With its modular and scalable configuration options, the DEK NeoHorizon printer meets any process requirements and offers best flexibility for any production volumes

DEK NeoHorizon Innovations

Best printing offering to cover all your needs

DEK NeoHorizon 03 iX:

Machine Alignment Capability: ±12.5 µm @ 2.0 cmk, (±6 Sigma)

System Alignment Capability: +/- 20μm @ 2.0 cmk, (±6 Sigma)

Wet Print Capability: ±25 µm @ 2.0 cpk, (±6 Sigma) - Certified by external system for every printer before delivery by standard

Core Cycle Time (CCT): 8 sec.

Perfect printing solution for best performance in high-mix production

DEK NeoHorizon 01 iX:

Machine Alignment Capability: ±12.5 µm @ 2.0 cmk, (±6 Sigma)

System Alignment Capability: +/- 15μm @ 2.0 cmk, (±6 Sigma)

Wet Print Capability: ±20 µm @ 2.0 cpk, (±6 Sigma) - Certified by external system for every printer before delivery by standard

Core Cycle Time (CCT): 6.5 sec.

Best printing quality with maximum throughput

DEK NeoHorizon Back-to-Back:

The DEK NeoHorizon Back-to-Back setup offers higher print performance in dual-lane assembly line.

DEK NeoHorizon Options

DEK provides the industry’s most powerful and flexible printing platforms. The following retrofittable DEK options help you further improve productivity and print quality on your DEK NeoHorizon printer:

1.Full flexible DEK All Purpose Clamping (APC) system

2.High flexibility and maximum cleaning performance with DEK Typhoon Cleaner

3.DEK Grid-Lok: the universal board support system

4.DEK Paste Management: the best combination of automated paste dispensing with paste roll height control

5.Closed loop to SPI systems with ProDEK

6.DEK Multiple Alignment of Singulated Substrates (MASS) offers a solution for individual optical alignment at a very high speed to boost your throughput

3.KOH YOUNG KY8030-3 3D SPI

World-Fastest Full 3D Solder Paste Inspection

The industry’s fastest full 3D measuring inspection solution- Solves shadow problems by utilizing 2-way projection- Full 3D foreign material inspection for the entire PCB- Provides accurate inspection data with real-time PCB warp compensation·Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory- Realizes real-time process optimization through powerful SPC analytics- Provides a powerful printing process optimization tool·Leading model for high-speed mass production line

4.SMT NG buffer Conveyor

● Exterior structure: plate gold structure and aluminum profile into the frame, the surface spray treatment and the color is wavy white.

● Microcomputer PLC control system works stably and reliably.

● Operating by touch screen, with automatic fault diagnosis function, convenient man-machine dialogue.

● Multiple sound and light and touch screen inside prompt alarm function.

● Using stepper motor to transmission.

● The bad board can be stored 10 pcs by rising and the good boards can be directly transported to the next machine.

● Applicable behind AOI and SPI devices.

● Double line number to distinguish NG\OK.

5.ASM SIPLACE X4i S Pick and Place Machine

The benchmark in high-volume production

Absolute precision and maximum performance have made the SIPLACE X S the placement platform of choice for demanding high-volume production applications such as network infrastructure (5G), large boards for server and industrial segments. Wherever top speed, lowest dpm rates, non-stop setup changeovers, fast new product introductions and the high-speed placement of the latest generations of super-small components (0201 metric) are needed – the SIPLACE X S delivers.

Highlights of the ASM SIPLACE X S:

SIPLACE Placement Head CP20 for high-speed and placement of components as small as 0201 (metric) with maximum precision

CP20 Head – for maximum accuracy and speed:
- For components ranging from 0.12 × 0.12 mm (L × W) to 8.2 mm × 8.2 mm and 4 mm (L × W × H)
- Speed: Up to 48,000 cph
- Accuracy: Up to ±25 μm @ 3 σ
- Placement force: 0.5 N to 4.5 N
- Perfect for the fast assembly of standard components at the head of the SMT line

SIPLACE Placement Head CPP – the only head that automatically changes modes on demand (C&P, P&P, Mixed Mode)

CPP Head – for maximum flexibility:
- Switches as needed between pick-and-place, collect-and-place and mixed modes
- For components ranging from 01005 metric to 50 × 40 x 15.5 mm (L × W × H)
- Speed: Up to 25,500 cph
- Accuracy: Up to ±34 μm @ 3 σ
- For perfectly balanced line operation during quick product changeovers with no time-consuming configuration and head changes

SIPLACE Placement Head TWIN – the head for special tasks

Twin Head – for maximum force:
- Places components ranging from 0201 metric to 200 × 110 × 25 mm (L×W×H)
- Speed: Up to 5,500 cph
- Accuracy: Up to ±22 μm @ 3 σ
- Placement force: 1.0 N to 30 N
- Snap-in detection and 3D measurement in real time
- Perfectly suited for automated end-of-line placement of large and heavy components such as connectors, specialty components, and odd shapes

Digital SIPLACE vision system for maximum process stability

Available with two, three and four gantries and smart conveyor options for optimized line configurations

Modular gantries to meet any production challenges

SIPLACE Smart Pin Support for automatic placement of PCB support pins

6.HELLER 2043 MK7 SMT Reflow Soldering Oven

The 2043 MK7 reflow oven machine is an ultra-high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min. The 2043 offers the lowest delta T’s, reduced nitrogen and electrical consumption and advanced flux management options. The 12” wide heater modules offer profile compatibility with competitor systems.

- Built-in Thermal Monitoring

- Nitrogen Capable to < 100 ppm

- Energy Management System

- Virtually No Maintenance

- 12” Wide Heater Modules

Oven Length	723cm (285”)
Process Gas Options	Air, Nitrogen
Heated Zones	Convection: 13 Top / 13 Bottom
Heated Length	449 cm (177”)
Cool Zones	3 Top (Bottom Option)
Max Working Temperature	Standard: 350°C (Option: 400°C)
Maximum PCB Width	55.9cm (22”)
Cleanroom Option	Down to Class 1000

7. KOH YOUNG ZENITH 3D AOI

Ultimate Solution for Inspection Challenges

Circuit boards are becoming more complex with new products. An AOI machine is becoming even more crucial to the electronics manufacturing lines. The industry has many2D, 2.5D and pseudo-3D inspection options that only compound issues with false calls and escapes. The Zenith AOI Series is the only machine that delivers True 3D Inspection to address solutions caused by highly specular packages and shadows from adjacent parts.

Incomparable True 3D Inspection Performance

The Zenith AOI Series is the only solution in the industry to base its inspection criteria according to IPC-610 standards for electronic assembly acceptability requirements. It provides clear and precise AOI measurements to accurately identify multiple defects such as missing solder, offset, polarity, upside down, OCV/OCR, solder fillet, billboarding, lifted lead, lifted body, tombstone, bridging, and more. Because it uses a quantitative True 3D measurement-based approach, the system delivers exceptional accuracy and repeatability.

IPC-based Solder Joint Inspection

Through Koh Young’s proprietary vison algorithms, the Zenith Series can quantify the exact height of a solder joint. Despite shadows or interreflection challenges, the Zenith accurately inspects and measures according to IPC-610 standards for electronic assembly acceptability requirements.

AI-Powered Auto Programming (KAP)

Industry-leading 3D profilometry technology converges with Koh Young’s proprietary AI technology to deliver true automatic programming. The innovative geometry-based Koh Young Auto Programming (KAP) software solution reduces the programming process to minimizes time to production and reduces costs.

KSMART Solutions: True 3D Measurement-based Process Control System

Koh Young pioneered True 3D measurement technology 20 years ago to create a zero-defect

8.NGOK Unloader Machine

According to signal recognition, NG board and OK board are automatically collected into two lifting turnover boxes respectively; The NG\OK receiver is connected with AOI, after AOI detection to determine the good (OK) and bad (NG) output different signals, the signal is transmitted to the next NG\OK receiver, the NG\OK receiver receives the signal sent by AOI for judgment, and the PCB is automatically classified and stored in the OK and NG material frame; Such as: AOI output OK signal through NG\OK judgment into the moving trolley directly into the OK lifting trolley material frame; The AOI output NG signal is judged by NG\OK into the moving car and transferred to the material frame of the NG lifting car at the back.

Appearance structure :3mm thick sheet metal structure and aluminum profiles into the frame, surface spray treatment, color is corrugated white.
Microcomputer original Panasonic PLC control system, stable and reliable work.
Touch screen display operation, with automatic fault diagnosis function, man-machine dialogue is convenient.
Multiple sound, light and touch screen prompt alarm function.
The lifting step of the rack can be set according to the PCB thickness.
With automatic counting function, convenient production statistics.
Humanized design ensures that the PCB board is not broken and improves the output capacity
The bottom connecting PCB board uses a motor to push the board into the material frame
Stepper motor push plate, strength, speed can be set on the touch screen,
The push-plate device uses the Omron groove sensor to protect the PCB board from being pushed out
Push the PCB board can set the push distance in the touch screen
The OK plate is loaded into the front material frame, and the NG plate is loaded into the fabric frame.
Double line number distinguish NG\OK