PARMI CPI 100 2D AOI for Conformal Coating Inspection

Board Dimensions: 410 x 350 mm (standard), 510 x 510 mm (large).
Vision System: High-resolution camera with 2 channel LED illumination (UV & White light), and a Laser module for height measurement.
Working Distance: Up to 80mm from the PCB surface, suitable for inspecting tall components.
Inspection Method: Unlike Field of View (FOV) inspection, the PCI 100 acquires images by scanning the entire board.

BASIC INFO

PARMI CPI 100 2D AOI for Conformal Coating Inspection

The PCI 100 is a pioneering scan-based precision conformal coating inspection system from PARMI. It stands out as the first of its kind, offering comprehensive inspection capabilities including coverage, contamination, and bubble detection. This system is adept at measuring panel and component thickness with its height-measuring laser sensor and is capable of inspecting coating and coating thickness on tall components with its Z-axis adjustment.

Key Features

System Dimension: 850 x 1205 x 1520 mm (standard), 950 x 1205 x 1525 mm (large), and weight of 700 kg (standard), 820 kg (large).

Board Dimensions: 410 x 350 mm (standard), 510 x 510 mm (large).

Vision System: High-resolution camera with 2 channel LED illumination (UV & White light), and a Laser module for height measurement.

Image Pixel Resolution: Using a telecentric lens for distortion-free images. High Speed – 16.7µm, Scan Speed (Sq.cm/sec) 100 with scan width 38mm, High Resolution – 11.7µm, Scan Speed (Sq.cm/sec) 60 with scan width 26mm.

Working Distance: Up to 80mm from the PCB surface, suitable for inspecting tall components.

Inspection Method: Unlike Field of View (FOV) inspection, the PCI 100 acquires images by scanning the entire board.

System Dimensions: The standard system measures 850 × 1,205 × 1,525 mm and weighs 700 kg, while the larger version measures 950 × 1,205 × 1,525 mm and weighs 820 kg.

Technical Specification

Vision System: High-resolution camera with 2 channel LED illumination (UV & White light), and a Laser module for height measurement.

Image Pixel Resolution: 16.7µm, using a telecentric lens for distortion-free images.

Working Distance: Up to 80mm from the PCB surface, suitable for inspecting tall components.

Inspection Method: Unlike Field of View (FOV) inspection, the PCI 100 acquires images by scanning the entire board.

System Dimensions: The standard system measures 850 × 1,205 × 1,525 mm and weighs 700 kg, while the larger version measures 950 × 1,205 × 1,525 mm and weighs 820 kg.