PARMI SIGMA X 3D Paste Inspection

Dual laser technology eliminates shadowing
Compatible with all PCB colors, finishes and HASLs.
Identifies all features, including bores, vias, board edge and crimps.
High respectability and accuracy with height measurements of +/- 1mm

BASIC INFO

PARMI SIGMA X 3D Paste Inspection

The PARMI SIGMA X series is a new generation of 3D solder paste detection equipment that adopts dual laser projection and RSC VII 3D sensor. It supports real-time closed-loop control, full board warpage measurement and precise defect analysis. It is compatible with various PCB board types and solder paste types, and combines high-speed detection with high reliability. Help optimize the electronic manufacturing process and control quality.

Feature

1.Real-time data monitoring and closed-loop control, automatically feedback printing offset and rotation parameters and start the steel mesh wiping program.

2.3D precise detection, covering multi-dimensional measurements such as solder paste height, area, volume, offset, and bridging, without shadow interference.

3.Defect analysis and SPC statistics support defect analysis by dimensions such as time and product model, and provide visual 3D images and process capability data.

4.Full-plate warpage tracking, capable of detecting ±5mm warpage, ensures the stability of the measurement focus through Z-axis motion control.

5.Remote monitoring and flexible adaptation, supporting remote control of multiple devices, compatible with PCB boards of different sizes and thicknesses and lead-free/lead-containing solder pastes.